ISSN 1551-4897
Vol. 20, Issue 2, 2023April 01, 2023 EDT
Double-Sided Integrated GaN Power Module with Double Pulse Test (DPT) Verification
Double-Sided Integrated GaN Power Module with Double Pulse Test (DPT) Verification
Articles in Vol. 20, Issue 2, 2023
Vol. 20, Issue 2, 2023
- State-of-the-Art in Chiplets Horizontal CommunicationsJohn H. Lau
- Investigation into Impact of Redistribution Layer Design on Thermomechanical Stress in Embedded-Die PackageMasamitsu MatsuuraTanemasa AsanoHaruichi Kanaya
- Double-Sided Integrated GaN Power Module with Double Pulse Test (DPT) VerificationSourish S. SinhaTzu-Hsuan ChengDouglas C. Hopkins
- A Drop-In High-Temperature Pb-Free Solder Paste That Outperforms High-Pb Pastes in Power Discrete ApplicationsHongwen ZhangTyler RichmondKyle AserianSamuel LytwynecTybarius HarterDiego Prado
Sinha, Sourish S., Tzu-Hsuan Cheng, and Douglas C. Hopkins. 2023. “Double-Sided Integrated GaN Power Module with Double Pulse Test (DPT) Verification.” Journal of Microelectronics and Electronic Packaging 20 (2): 71–81. https://doi.org/10.4071/001c.81980.