ISSN 1551-4897
Vol. 11, Issue 1, 2014January 01, 2014 EDT
LT-TLPS Die Attach for High Temperature Electronic Packaging
LT-TLPS Die Attach for High Temperature Electronic Packaging
Articles in Vol. 11, Issue 1, 2014
Vol. 11, Issue 1, 2014
- Redistribution Layers (RDLs) for 2.5D/3D IC IntegrationJ. LauP. TzengC. LeeC. ZhanM. LiJ. ClineK. SaitoY. HsinP. ChangY. ChangJ. ChenS. ChenC. WuH. ChangC. ChienC. LinT. KuR. LoM. Kao
- Void Formation and Bond Strength Investigated for Wafer-Level Cu-Sn Solid-Liquid Interdiffusion (SLID) BondingAstrid-Sofie B. VardøyH. J. van de WielStian MartinsenGreg R. HayesHartmut R. FischerKnut E. AasmundtveitAdriana LapadatuMaaike M. V. Taklo
- Effects of Copper Pattern Density and Orientation on the Modulus of BGA SubstratesBurton CarpenterBetty YeungYuan Yuan
- Mechanical Stress Analyses of Packaged Pressure Sensors for Very High TemperaturesRoderich ZeiserSuleman AyubJochen HempelMichael BerndtJuergen Wilde
- Ultra Low Weight Spacer for PCB to PCB InterconnectionsLuca PetriccaPer OhlckersGeir Morten Mellem
- Reliability of SiC Digital Telemetry Circuits on AlN SubstrateReza GhandiCheng-Po ChenLiang YinRich SaiaTammy JohnsonPeter SandvikKun FangR. Wayne Johnson
- LT-TLPS Die Attach for High Temperature Electronic PackagingHannes GreveF. Patrick McCluskey
Greve, Hannes, and F. Patrick McCluskey. 2014. “LT-TLPS Die Attach for High Temperature Electronic Packaging.” Journal of Microelectronics and Electronic Packaging 11 (1): 7–15. https://doi.org/10.4071/imaps.394.