ISSN 1551-4897
Vol. 5, Issue 4, 2008October 01, 2008 EDT
Second- and Third-Level BGA Solder Joint Reliability of High-End Flip Chip System in Package (FCSiP)
Second- and Third-Level BGA Solder Joint Reliability of High-End Flip Chip System in Package (FCSiP)
Articles in Vol. 5, Issue 4, 2008
Vol. 5, Issue 4, 2008
- Systematic Characterization of Embossing Processes for LTCC TapesHeike Bartsch de TorresRobert GadeArne AlbrechtMartin Hoffmann
- Thick Film Accelerometers in LTCC Technology—Design Optimization, Fabrication, and CharacterizationHolger NeubertUwe PartschDaniel FleischerMathias GruchowAlfred KamusellaThe-Quan Pham
- Power Inductors in Ceramic Multilayer Circuit BoardsRichard MatzDieter GötschThomas GoßnerRoman KarmazinRuth MännerBernhard Siessegger
- High Layer Count in LTCC Dual Band Antenna for Galileo GNSSPeter UhligDirk ManteuffelStefan Malkmus
- Morphological and Electrical Properties of Silver Thin Films Sputter Deposited on LTCC SubstratesA. BittnerT. BohnenbergerR. EngelH. SeidelU. Schmid
- Predicting the Thermal Conductivity of Low Temperature Co-fired Ceramic with Embedded Thermal via Arrays using the Rule-of-Mixtures and Interface Area Analytical MethodsT.S. Vincent
- Second- and Third-Level BGA Solder Joint Reliability of High-End Flip Chip System in Package (FCSiP)Sang Ha KimChika KakegawaHiroshi TabuchiHan Park
Kim, Sang Ha, Chika Kakegawa, Hiroshi Tabuchi, and Han Park. 2008. “Second- and Third-Level BGA Solder Joint Reliability of High-End Flip Chip System in Package (FCSiP).” Journal of Microelectronics and Electronic Packaging 5 (4): 180–87. https://doi.org/10.4071/1551-4897-5.4.180.