ISSN 1551-4897
Vol. 5, Issue 4, 2008October 01, 2008 EDT
Thick Film Accelerometers in LTCC Technology—Design Optimization, Fabrication, and Characterization
Thick Film Accelerometers in LTCC Technology—Design Optimization, Fabrication, and Characterization
Articles in Vol. 5, Issue 4, 2008
Vol. 5, Issue 4, 2008
- Systematic Characterization of Embossing Processes for LTCC TapesHeike Bartsch de TorresRobert GadeArne AlbrechtMartin Hoffmann
- Thick Film Accelerometers in LTCC Technology—Design Optimization, Fabrication, and CharacterizationHolger NeubertUwe PartschDaniel FleischerMathias GruchowAlfred KamusellaThe-Quan Pham
- Power Inductors in Ceramic Multilayer Circuit BoardsRichard MatzDieter GötschThomas GoßnerRoman KarmazinRuth MännerBernhard Siessegger
- High Layer Count in LTCC Dual Band Antenna for Galileo GNSSPeter UhligDirk ManteuffelStefan Malkmus
- Morphological and Electrical Properties of Silver Thin Films Sputter Deposited on LTCC SubstratesA. BittnerT. BohnenbergerR. EngelH. SeidelU. Schmid
- Predicting the Thermal Conductivity of Low Temperature Co-fired Ceramic with Embedded Thermal via Arrays using the Rule-of-Mixtures and Interface Area Analytical MethodsT.S. Vincent
- Second- and Third-Level BGA Solder Joint Reliability of High-End Flip Chip System in Package (FCSiP)Sang Ha KimChika KakegawaHiroshi TabuchiHan Park
Neubert, Holger, Uwe Partsch, Daniel Fleischer, Mathias Gruchow, Alfred Kamusella, and The-Quan Pham. 2008. “Thick Film Accelerometers in LTCC Technology—Design Optimization, Fabrication, and Characterization.” Journal of Microelectronics and Electronic Packaging 5 (4): 150–55. https://doi.org/10.4071/1551-4897-5.4.150.