ISSN 1551-4897
Articles in Vol. 5, Issue 4, 2008
Vol. 5, Issue 4, 2008
- Systematic Characterization of Embossing Processes for LTCC TapesHeike Bartsch de TorresRobert GadeArne AlbrechtMartin Hoffmann
- Thick Film Accelerometers in LTCC Technology—Design Optimization, Fabrication, and CharacterizationHolger NeubertUwe PartschDaniel FleischerMathias GruchowAlfred KamusellaThe-Quan Pham
- Power Inductors in Ceramic Multilayer Circuit BoardsRichard MatzDieter GötschThomas GoßnerRoman KarmazinRuth MännerBernhard Siessegger
- High Layer Count in LTCC Dual Band Antenna for Galileo GNSSPeter UhligDirk ManteuffelStefan Malkmus
- Morphological and Electrical Properties of Silver Thin Films Sputter Deposited on LTCC SubstratesA. BittnerT. BohnenbergerR. EngelH. SeidelU. Schmid
- Predicting the Thermal Conductivity of Low Temperature Co-fired Ceramic with Embedded Thermal via Arrays using the Rule-of-Mixtures and Interface Area Analytical MethodsT.S. Vincent
- Second- and Third-Level BGA Solder Joint Reliability of High-End Flip Chip System in Package (FCSiP)Sang Ha KimChika KakegawaHiroshi TabuchiHan Park
Matz, Richard, Dieter Götsch, Thomas Goßner, Roman Karmazin, Ruth Männer, and Bernhard Siessegger. 2008. “Power Inductors in Ceramic Multilayer Circuit Boards.” Journal of Microelectronics and Electronic Packaging 5 (4): 161–68. https://doi.org/10.4071/1551-4897-5.4.161.