ISSN 1551-4897
Vol. 5, Issue 4, 2008October 01, 2008 EDT
Predicting the Thermal Conductivity of Low Temperature Co-fired Ceramic with Embedded Thermal via Arrays using the Rule-of-Mixtures and Interface Area Analytical Methods
Predicting the Thermal Conductivity of Low Temperature Co-fired Ceramic with Embedded Thermal via Arrays using the Rule-of-Mixtures and Interface Area Analytical Methods
Articles in Vol. 5, Issue 4, 2008
Vol. 5, Issue 4, 2008
- Systematic Characterization of Embossing Processes for LTCC TapesHeike Bartsch de TorresRobert GadeArne AlbrechtMartin Hoffmann
- Thick Film Accelerometers in LTCC Technology—Design Optimization, Fabrication, and CharacterizationHolger NeubertUwe PartschDaniel FleischerMathias GruchowAlfred KamusellaThe-Quan Pham
- Power Inductors in Ceramic Multilayer Circuit BoardsRichard MatzDieter GötschThomas GoßnerRoman KarmazinRuth MännerBernhard Siessegger
- High Layer Count in LTCC Dual Band Antenna for Galileo GNSSPeter UhligDirk ManteuffelStefan Malkmus
- Morphological and Electrical Properties of Silver Thin Films Sputter Deposited on LTCC SubstratesA. BittnerT. BohnenbergerR. EngelH. SeidelU. Schmid
- Predicting the Thermal Conductivity of Low Temperature Co-fired Ceramic with Embedded Thermal via Arrays using the Rule-of-Mixtures and Interface Area Analytical MethodsT.S. Vincent
- Second- and Third-Level BGA Solder Joint Reliability of High-End Flip Chip System in Package (FCSiP)Sang Ha KimChika KakegawaHiroshi TabuchiHan Park
Vincent, T.S. 2008. “Predicting the Thermal Conductivity of Low Temperature Co-Fired Ceramic with Embedded Thermal via Arrays Using the Rule-of-Mixtures and Interface Area Analytical Methods.” Journal of Microelectronics and Electronic Packaging 5 (4): 174–79. https://doi.org/10.4071/1551-4897-5.4.174.