ISSN 1551-4897
Vol. 5, Issue 4, 2008October 01, 2008 EDT
Systematic Characterization of Embossing Processes for LTCC Tapes
Systematic Characterization of Embossing Processes for LTCC Tapes
Articles in Vol. 5, Issue 4, 2008
Vol. 5, Issue 4, 2008
- Systematic Characterization of Embossing Processes for LTCC TapesHeike Bartsch de TorresRobert GadeArne AlbrechtMartin Hoffmann
- Thick Film Accelerometers in LTCC Technology—Design Optimization, Fabrication, and CharacterizationHolger NeubertUwe PartschDaniel FleischerMathias GruchowAlfred KamusellaThe-Quan Pham
- Power Inductors in Ceramic Multilayer Circuit BoardsRichard MatzDieter GötschThomas GoßnerRoman KarmazinRuth MännerBernhard Siessegger
- High Layer Count in LTCC Dual Band Antenna for Galileo GNSSPeter UhligDirk ManteuffelStefan Malkmus
- Morphological and Electrical Properties of Silver Thin Films Sputter Deposited on LTCC SubstratesA. BittnerT. BohnenbergerR. EngelH. SeidelU. Schmid
- Predicting the Thermal Conductivity of Low Temperature Co-fired Ceramic with Embedded Thermal via Arrays using the Rule-of-Mixtures and Interface Area Analytical MethodsT.S. Vincent
- Second- and Third-Level BGA Solder Joint Reliability of High-End Flip Chip System in Package (FCSiP)Sang Ha KimChika KakegawaHiroshi TabuchiHan Park
Torres, Heike Bartsch de, Robert Gade, Arne Albrecht, and Martin Hoffmann. 2008. “Systematic Characterization of Embossing Processes for LTCC Tapes.” Journal of Microelectronics and Electronic Packaging 5 (4): 142–49. https://doi.org/10.4071/1551-4897-5.4.142.