Electromigration in Power Devices: A Combined Effect of Electromigration and Thermal Migration

Hao Zhuang; Robert Bauer; Markus Dinkel

doi:10.4071/imaps.1377365

Zhuang, Hao, Robert Bauer, and Markus Dinkel. 2021. “Electromigration in Power Devices: A Combined Effect of Electromigration and Thermal Migration.” Journal of Microelectronics and Electronic Packaging 18 (1): 1–6. https://doi.org/10.4071/imaps.1377365.

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Electromigration in Power Devices: A Combined Effect of Electromigration and Thermal Migration

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