ISSN 1551-4897
Vol. 6, Issue 1, 2009January 01, 2009 EDT
Silicon on Ceramics—A New Integration Concept for Silicon Devices to LTCC
Silicon on Ceramics—A New Integration Concept for Silicon Devices to LTCC
Articles in Vol. 6, Issue 1, 2009
Vol. 6, Issue 1, 2009
- Enhancement of Fine Line Print Resolution due to Coating of Screen FabricsDieter SchwankeJürgen PohlnerAndreas WonischTorsten KraftJürgen Geng
- Validation of Alternative RoHS Compliant Au Pastes for the DuPont LTCC 951 SystemBernhard MusslerDieter Schwanke
- Hermetic Package for Optical MEMSF. SeigneurY. FournierT. MaederP. RyserJ. Jacot
- Ceramic Microwave Circuits for Satellite CommunicationR. KulkeG. MöllenbeckC. GünnerP. UhligK.H. DrüeS. HumblaJ. MüllerR. StephanD. StöpelJ.F. TrabertG. VogtM.A. HeinA. MolkeT. BarasA.F. JacobD. SchwankeJ. PohlnerA. SchwarzG. Reppe
- Multi-Layer Ceramic Packaging for High Frequency Mixed-Signal VLSI ASICSLewis Dove
- Miniaturized Embossed Low Resistance Fine Line Coils in LTCCR. PerroneH. Bartsch de TorresM. HoffmannM. MachJ. Müller
- Effects of Silver Paste Application on Embedded Channels in Low Temperature Co-fired CeramicsDouglas L. KellisAmy J. MollDonald G. Plumlee
- Combined Manufacture Methods for High Density LTCC Substrates: Thick Film Screen Printing, Ink Jet, Postfiring Thin Film Processes, and Laser-Drilled Fine ViasArne AlbertsenKoji KoiwaiKyoji KobayashiTomonori OguchiKatsumi Aruga
- Silver-Indium Transient Liquid Phase Sintering for High Temperature Die AttachmentPedro O. QuinteroF. Patrick McCluskey
- A Feasibility Study of Lead Free Solders for Level 1 Packaging ApplicationsVivek ChidambaramJohn HaldJesper Hattel
- The Effect of Ultrasonic Frequency on Gold Wire Bondability and ReliabilityJianbiao PanMinh-Nhat LeCuong Van Pham
- The Impact of Glass-to-Resin Ratio and Sample Construction on the CTE of a High Temperature LaminateJoe KuczynskiSilvio Bertling
- Reliability Assessment and Failure Analysis of G-Helix, a Free-Standing Compliant Off-Chip InterconnectKaran KackerSuresh K. Sitaraman
- Silicon on Ceramics—A New Integration Concept for Silicon Devices to LTCCM. FischerH. Bartsch de TorresB. PawlowskiR. GadeS. BarthM. MachM. StubenrauchM. HoffmannJ. Müler
- LTCC-Modules with Integrated Ferrite Layers—Strategies for Material Development and Co-SinteringCarsten GlitzkyTorsten RabeMarkus EbersteinWolfgang A. SchillerJörg TöpferStefan BarthAnnette Kipka
Fischer, M., H. Bartsch de Torres, B. Pawlowski, R. Gade, S. Barth, M. Mach, M. Stubenrauch, M. Hoffmann, and J. Müler. 2009. “Silicon on Ceramics—A New Integration Concept for Silicon Devices to LTCC.” Journal of Microelectronics and Electronic Packaging 6 (1): 1–5. https://doi.org/10.4071/1551-4897-6.1.1.