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ISSN 1551-4897
General
Vol. 6, Issue 1, 2009January 01, 2009 EDT

Reliability Assessment and Failure Analysis of G-Helix, a Free-Standing Compliant Off-Chip Interconnect

Karan Kacker, Suresh K. Sitaraman,
wafer level packagingchip to substrate interconnectsfirst level interconnectscompliant interconnectsflip chip assembly
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/1551-4897-6.1.59

Articles in Vol. 6, Issue 1, 2009

Vol. 6, Issue 1, 2009
  • Enhancement of Fine Line Print Resolution due to Coating of Screen Fabrics
    Dieter SchwankeJürgen PohlnerAndreas WonischTorsten KraftJürgen Geng
  • Validation of Alternative RoHS Compliant Au Pastes for the DuPont LTCC 951 System
    Bernhard MusslerDieter Schwanke
  • Hermetic Package for Optical MEMS
    F. SeigneurY. FournierT. MaederP. RyserJ. Jacot
  • Ceramic Microwave Circuits for Satellite Communication
    R. KulkeG. MöllenbeckC. GünnerP. UhligK.H. DrüeS. HumblaJ. MüllerR. StephanD. StöpelJ.F. TrabertG. VogtM.A. HeinA. MolkeT. BarasA.F. JacobD. SchwankeJ. PohlnerA. SchwarzG. Reppe
  • Multi-Layer Ceramic Packaging for High Frequency Mixed-Signal VLSI ASICS
    Lewis Dove
  • Miniaturized Embossed Low Resistance Fine Line Coils in LTCC
    R. PerroneH. Bartsch de TorresM. HoffmannM. MachJ. Müller
  • Effects of Silver Paste Application on Embedded Channels in Low Temperature Co-fired Ceramics
    Douglas L. KellisAmy J. MollDonald G. Plumlee
  • Combined Manufacture Methods for High Density LTCC Substrates: Thick Film Screen Printing, Ink Jet, Postfiring Thin Film Processes, and Laser-Drilled Fine Vias
    Arne AlbertsenKoji KoiwaiKyoji KobayashiTomonori OguchiKatsumi Aruga
  • Silver-Indium Transient Liquid Phase Sintering for High Temperature Die Attachment
    Pedro O. QuinteroF. Patrick McCluskey
  • A Feasibility Study of Lead Free Solders for Level 1 Packaging Applications
    Vivek ChidambaramJohn HaldJesper Hattel
  • The Effect of Ultrasonic Frequency on Gold Wire Bondability and Reliability
    Jianbiao PanMinh-Nhat LeCuong Van Pham
  • The Impact of Glass-to-Resin Ratio and Sample Construction on the CTE of a High Temperature Laminate
    Joe KuczynskiSilvio Bertling
  • Reliability Assessment and Failure Analysis of G-Helix, a Free-Standing Compliant Off-Chip Interconnect
    Karan KackerSuresh K. Sitaraman
  • Silicon on Ceramics—A New Integration Concept for Silicon Devices to LTCC
    M. FischerH. Bartsch de TorresB. PawlowskiR. GadeS. BarthM. MachM. StubenrauchM. HoffmannJ. Müler
  • LTCC-Modules with Integrated Ferrite Layers—Strategies for Material Development and Co-Sintering
    Carsten GlitzkyTorsten RabeMarkus EbersteinWolfgang A. SchillerJörg TöpferStefan BarthAnnette Kipka
Journal of Microelectronics & Elect Pkg
Kacker, Karan, and Suresh K. Sitaraman. 2009. “Reliability Assessment and Failure Analysis of G-Helix, a Free-Standing Compliant Off-Chip Interconnect.” Journal of Microelectronics and Electronic Packaging 6 (1): 59–65. https://doi.org/10.4071/1551-4897-6.1.59.
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